
A roadmap for the future chip coolant temperature
The Open Compute Project (OCP) and major silicon vendors (NVIDIA, AMD, Intel) collaborated on a white paper proposing a 30°C minimum coolant temperature standard for AI/ML hardware cooling. This stand…

Beyond the compressor-less hype: Matching data center cooling technology to climate reality
Vertiv’s research debunks the myth that higher chip temperatures universally enable compressor-less cooling, emphasizing geography, ambient conditions, and water availability as critical factors. The …
Designing liquid cooling infrastructure for scalability: Best practices for future growth
Vertiv published a guide on designing liquid cooling infrastructure for scalability, emphasizing oversized headers, modular components, and phased expansion to avoid costly retrofits. The article high…
Compass Datacenters and Vertiv industrialize the overhead layer for AI scale
Compass Datacenters and Vertiv deployed Vertiv SmartRun, an overhead prefabricated infrastructure system, to streamline data hall deployment for AI workloads. The standardized, factory-assembled syste…

The Vertiv view: Intelligent infrastructure’s Henry Ford moment
Vertiv and NVIDIA are collaborating to enable gigawatt-scale AI factories, where power, cooling, and compute are co-designed as a single system. Digital twin technology and prefabricated modules aim t…
Smarter resilience: Advanced maintenance and battery technologies powering next-gen data centers
Vertiv introduced EnergyCore Lithium battery cabinets featuring integrated battery management, real-time SOC/SOH monitoring, and compatibility with AI-driven power demands. The solution reduces footpr…
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